Mengyu Yang | 杨梦宇

I'm a third-year undergraduate student from Yingcai Honors College of University of Electronic Science and Technology of China , majoring in computer science and technology. Currently, I am actively seeking opportunities for a master or PhD degree .

My research interest lies in 3D/4D Vision, Video, Spatial Intelligence and Agent.

Email  /  Google Scholar  /  Github

profile photo
News
  • [2026-07]: 🎉One paper is accepted by Applied Intelligence.
  • [2026-06]: 🎉One paper is accepted by ECCV2026.
  • [2026-06]: 🎉🎉Honored to receive the SenseTime Scholarship 2026! (30 undergraduates nationwide)
  • [2026-02]: 🎉One paper on 3D Vision is accepted by CVPR2026.
  • [2025-10]: 🎉Honored to receive the National Scholarship for the second time.
  • [2025-05]: 🎉Awarded Finalist in the COMAP 2025 Interdisciplinary Contest in Modeling (ICM).
  • [2024-10]: 🎉Honored to receive the National Scholarship for the first time.

Selected Publications

*Equal contribution    Project leader

[Image Description] Fast3Dcache: Training-free 3D Geometry Synthesis Acceleration
Mengyu Yang, Yanming Yang , Chenyi Xu , Chenxi Song , Yufan Zuo , Tong Zhao , Ruibo Li , Chi Zhang
[CVPR 2026]
[arXiv] [Code] [Project Page]


[Image Description] WildCity: A Real-World City-Scale Testbed for Rendering, Simulation, and Spatial Intelligence
Xiangyu Han, Mengyu Yang, Jiaqi Li , Bowen Chang , Ziyu Chen , Hexu Zhao , Rahul Kumar Agrawal , Anthony Rodriguez , Rajani Acharya , Fiona Hua , Marco Pavone, Chen Feng , Yiming Li
[ECCV 2026]
[arXiv] [Code] [Project Page]
My Honors and Awards

  • National Scholarship * 2 (Highest honor for Chinese undergraduates)
  • SenseTime Scholarship 2026 (30 undergraduates nationwide every year)
  • Academic Ranking
    Top 1/80 in honors plan · Top 1/164 in major · GPA 4.00/4.00 · weighted average 96.38/100
  • Selected as the 2025 Student of the Year of the honors plan.
  • Finalist in the COMAP Interdisciplinary Contest in Modeling (ICM) (2025)

  • Website Template


    © Mengyu Yang | Last updated: [07, 2026]